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hlmp-hg64, hlmp-hm64, hlmp-hb64 precision optical performance red, green and blue new 5mm standard oval leds data sheet caution: ingan devices are class 1c hbm esd sensitive per jedec standard. please observe appropriate precautions during handling and processing. refer to application note an C 1142 for additional details. features well de?ned spatial radiation pattern high brightness material available in red, green and blue color red alingap 626 nm green ingan 525nm blue ingan 470nm superior resistance to moisture non-stando? package tinted and di?used typical viewing angle 40 x 100 applications full color signs description these precision optical performance oval leds are spe- ci?cally designed for full color/video and passenger infor- mation signs. the oval shaped radiation pattern and high luminous intensity ensure that these devices are excellent for wide ?eld of view outdoor applications where a wide viewing angle and readability in sunlight are essential. the package epoxy contains both uv-a and uv-b inhibi- tors to reduce the e?ects of long term exposure to direct sunlight. package dimensions notes: all dimensions in millimeters (inches). tolerance is 0.20mm unless other speci?ed 1.02 ma x. 0.0 4 0 ma x. 0.70 ma x. .028 5.20 0.20 4 7.00 0.275 0.98 4 min 25.00 min .039 1.00 m in. .020.00 4 0.500.10 s q. ty p . c a tho d e l e ad 2.5 4 0.10 3.80 0.150
2 device selection guide part n umber c olor and dominant wavelength d (nm) t y p luminous intensit y iv (mcd) at 20 ma-min [1] luminous intensit y iv (mcd) at 20 ma-max [1] HLMP-HG64-VY0XX red 626 1150 2400 hlmp-hm64-y30xx green 525 1990 5040 hlmp-hb64-qu0xx blue 470 460 1150 tolerance for each intensity limit is 15%. notes: 1. the luminous intensity is measured on the mechanical axis of the lamp package and it is tested in pulsing condition. part n umbering s y stem note: please refer to ab 5337 for complete information about part numbering system. h lmp - h x 64 - x x x x x packaging o p t ion zz : f l exi ammopack dd: ammopacks c o l or bin se l ec t ion 0: open distribution maximum i n t ensi ty bin 0: no maximum intensity l imit minimum i n t ensi ty bin refer to device se l ection guide. s t ando ff/ n on s t ando ff 4: non-standoff c o l or g: red 626 m: green 525 b: b l ue 470 package h: 5mm standard ova l 40 x 1 00
3 absolute maximum ratings t j = 25c parameter red green and blue unit dc forward current [1] 50 30 ma peak forward current 100 [2] 100 [3] ma power dissipation 120 116 mw reverse voltage 5 (i r = 100 a) 5 (i r = 10 a) v led junction temperature 130 110 c operating temperature range -40 to +100 -40 to +85 c storage temperature range -40 to +100 -40 to +100 c notes: 1. derate linearly as shown in figure 4. 2. duty factor 30%, frequency 1khz. 3. duty factor 10%, frequency 1khz. e lectrical / o ptical c haracteristics t j = 25c parameter s y mbol min . t y p . max . units test c onditions forward voltage red green blue v f 1.8 2.8 2.8 2.1 3.2 3.2 2.4 3.8 3.8 vi f = 20 ma reverse voltage red green & blue v r 5 5 v i f = 100 a i f = 10 a dominant wavelength [1] red green blue d 618 520 460 626 525 470 630 540 480 nm i f = 20 ma peak wavelength red green blue peak 634 516 464 nm peak of wavelength of spectral distribution at i f = 20 ma thermal resistance r j-pin 240 c/w led junction-to-pin luminous e?cacy [2] red green blue v 150 530 65 lm/w emitted luminous power/emitted radiant power notes: 1. the dominant wavelength is derived from the chromaticity diagram and represents the color of the lamp 2. the radiant intensity, ie in watts per steradian, may be found from the equation ie = i v / v where i v is the luminous intensity in candelas and v is the luminous e?cacy in lumens/watt.
4 alingap red figure 1 . relative intensit y vs wavelength figure 2. forward c urrent vs forward voltage figure 3. relative intensit y vs forward c urrent figure 4 . maximum forward c urrent vs ambient temperature 0 1 0 20 30 4 0 50 6 0 0 20 4 0 6 0 80 1 00 t a - ambi en t t e mp e ratur e - c i f ma x . - ma x imum f o rward c urr en t - ma 0 0.2 0. 4 0. 6 0.8 1 550 6 00 6 50 700 wav e l en gth - nm r e lativ e i n t en sity 0 20 4 0 6 0 80 1 00 0 1 23 f o rward v o ltag e - v f o rward c urr en t - ma 0.0 0.5 1 .0 1 .5 2.0 2.5 3.0 3.5 4 .0 4 .5 5.0 020 4 0 6 080 1 00 d c f o rward c urr en t - ma r e lativ e lumi no us i n t en sity ( no rmaliz e d at 20 ma)
5 inga n blue and green figure 5. relative intensit y vs wavelength figure 6 . forward c urrent vs forward voltage figure 7. relative intensit y vs forward c urrent figure 8. maximum forward c urrent vs ambient temperature -1 0 - 8 -6 -4 - 2 0 2 4 6 8 1 0 020 4 0 6 080 1 00 f o rward c urr en t-ma r e lativ e d o mi n a n t wav e l en gth shift -nm gr een blu e 0.0 0. 1 0.2 0.3 0. 4 0.5 0. 6 0.7 0.8 0.9 1 .0 380 4 30 4 80 530 580 6 30 wav e l en gth - nm r e lativ e i n t en sity gr een blu e 0 5 1 0 1 5 20 25 30 35 0 20 4 0 6 0 80 1 00 t a - ambi en t t e mp e ratur e - c i f max - ma x imum f o rward c urr en t - ma 0 20 4 0 6 0 80 1 00 0 1 23 4 5 f o rward v o ltag e - v f o rward c urr en t - ma 0.0 0.5 1 .0 1 .5 2.0 2.5 3.0 3.5 020 4 0 6 080 1 00 1 20 d c f o rward c urr en t - ma r e lativ e lumi no us i n t en sity ( no rmaliz e d at 20 ma) gr een blu e figure 9. relative dominant wavelength vs forward c urrent
6 figure 1 0. radiation pattern C major axis figure 11 . radiation pattern C minor axis 0.0 0. 1 0.2 0.3 0. 4 0.5 0. 6 0.7 0.8 0.9 1 .0 - 90 -6 0 - 30 0 30 6 090 a n gular displa ce m en t - d e gr ee s no rmaliz e d i n t en sity red blue green 0.0 0. 1 0.2 0.3 0. 4 0.5 0. 6 0.7 0.8 0.9 1 .0 - 90 -6 0 - 30 0 30 6 090 a n gular displa ce m en t - d e gr ee s no rmaliz e d i n t en sity red blue green figure1 2. relative light o utput vs junction temperature figure 1 3. relative forward voltage vs junction temperature 0. 1 1 1 0 -4 0 - 20 0 20 4 0 6 080 1 00 1 20 14 0 t j - ju nc ti on t e mp e ratur e - c r e lativ e light o utput ( no rmaliz e d at tj = 25 c ) - 0. 4 - 0.3 - 0.2 - 0. 1 0 0. 1 0.2 0.3 -4 0 - 20 0 20 4 0 6 080 1 00 1 20 14 0 t j -ju nc ti on t e mp e ratur e f o rward v o ltag e shift-v r e d blu e gr een r e d gr een blu e
7 intensit y bin limit table (1 .2 : 1 iv bin ratio) bin intensit y (mcd) at 20 ma min max q 460 550 r 550 660 s 660 800 t 800 960 u 960 1150 v 1150 1380 w 1380 1660 x 1660 1990 y 1990 2400 z 2400 2900 1 2900 3500 2 3500 4200 3 4200 5040 tolerance for each bin limit is 15% v f bin table (v at 20 ma) bin id min max vd 1.8 2.0 va 2.0 2.2 vb 2.2 2.4 notes: 1. tolerance for each bin limit is 0.05v 2. v f binning only applicable to red color. red c olor range min dom max dom x min ymin x max ymax 618 630 0.6872 0.3126 0.6890 0.2943 0.6690 0.3149 0.7080 0.2920 tolerance for each bin limit is 0.5nm green c olor bin table bin min dom max dom x min ymin x max ymax 1 520.0 524.0 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 2 524.0 528.0 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 3 528.0 532.0 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 4 532.0 536.0 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 5 536.0 540.0 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 tolerance for each bin limit is 0.5nm. blue c olor bin table bin min dom max dom x min ymin x max ymax 1 460.0 464.0 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 2 464.0 468.0 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 3 468.0 472.0 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 4 472.0 476.0 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 5 476.0 480.0 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 tolerance for each bin limit is 0.5nm note: 1. all bin categories are established for classi?cation of products. products may not be available in all bin categories. please contact your avago representative for further information.
8 avago c olor bin on c i e 1 93 1 c hromaticit y diagram 4 green 5 4 3 2 1 red b l ue 5 3 2 1 0.000 0.200 0. 4 00 0. 6 00 0.800 1.000 0.000 0.100 0.200 0.300 0. 4 00 0.500 0. 6 00 0.700 0.800 x y
9 precautions: lead forming: the leads of an led lamp may be preformed or cut to length prior to insertion and soldering on pc board. for better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. if manual lead cutting is necessary, cut the leads after the soldering process. the solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into led package. this is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. soldering and handling: care must be taken during pcb assembly and soldering process to prevent damage to the led component. led component may be e?ectively hand soldered to pcb. however, it is only recommended under unavoidable circumstances such as rework. the closest manual soldering distance of the soldering heat source (soldering irons tip) to the body is 1.59mm. soldering the led using soldering iron tip closer than 1.59mm might damage the led. 1 .59mm esd precaution must be properly applied on the soldering station and personnel to prevent esd damage to the led component that is esd sensitive. do refer to avago application note an 1142 for details. the soldering iron used should have grounded tip to ensure electrostatic charge is properly grounded. recommended soldering condition: wave soldering [1, 2 ] manual solder dipping pre-heat temperature 105 c max. - preheat time 60 sec max - peak temperature 260 c max. 260 c max. dwell time 5 sec max. 5 sec max note: 1. above conditions refers to measurement with thermocouple mounted at the bottom of pcb. 2. it is recommended to use only bottom preheaters in order to reduce thermal stress experienced by led. wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. customer is advised to perform daily check on the soldering pro?le to ensure that it is always conforming to recommended soldering conditions. a li ngap device c a tho d e i nga n device a n d oe note: 1. pcb with di?erent size and design (component density) will have di?erent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering setting is used. so, it is recommended to re-calibrate the soldering pro?le again before loading a new type of pcb. 2. avago technologies allngap high brightness led are using high e?ciency led die with single wire bond as shown below. customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature does not exceed 260c and the solder contact time does not exceeding 5sec. over-stressing the led during soldering process might cause premature failure to the led due to delamination. avago technologies l e d con?guration any alignment ?xture that is being applied during wave soldering should be loosely ?tted and should not apply weight or force on led. non metal material is recommended as it will absorb less heat during wave soldering process. at elevated temperature, led is more susceptible to mechanical stress. therefore, pcb must allowed to cool down to room temperature prior to handling, which includes removal of alignment ?xture or pallet. if pcb board contains both through hole (th) led and other surface mount components, it is recommended that surface mount components be soldered on the top side of the pcb. if surface mount need to be on the bottom side, these components should be soldered using re?ow soldering prior to insertion the th led. recommended pc board plated through holes (pth) size for led component leads. l e d component lead size diagonal plated through hole diameter 0.45 x 0.45 mm (0.018x 0.018 inch) 0.636 mm (0.025 inch) 0.98 to 1.08 mm (0.039 to 0.043 inch) 0.50 x 0.50 mm (0.020x 0.020 inch) 0.707 mm (0.028 inch) 1.05 to 1.15 mm (0.041 to 0.045 inch) over-sizing the pth can lead to twisted led after clinching. on the other hand under sizing the pth can cause di?culty inserting the th led. refer to application note 5334 for more information about soldering and handling of high brightness th led lamps.
10 e xample o f wave soldering temperature pro?le f or th l e d ammo packs drawing 6 .35 1 .30 0.250.05 1 2 1 2.70 1 .00 0.500.039 4 c ath o d e 20.50 1 .00 0.807 1 0.039 4 4 .000.20 0. 1 5750.008 0.700.20 0.027 6 0.0079 1 2.700.30 0.500.0 11 8 9. 1 250. 6 25 0.35930.02 46 1 8.000.50 0.70870.0 1 97 typ ? vi e w a - a a a note: all dimensions in millimeters/(inches) recommended solder: sn63 (leaded solder alloy) sac305 (lead free solder alloy) flux: rosin ?ux solder bath temperature: 255c 5c (maximum peak temperature = 260c) dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) note: allow for board to be su?ciently cooled to room temperature before exerting mechanical force. 6 0 sec max tim e (sec) 2 6 0 c max 1 05 c max t e mp e ratur e ( c )
11 packaging box f or ammo packs lab e l on this sid e o f b ox fr o m l e ft sid e o f b ox adh e siv e tap e must b e fa c i n g upwards . a no d e l e ad l e av e s th e b ox first . note: for ingan device, the ammo pack packaging box contain esd logo packaging label (i) avago mother label: (available on packaging box of ammo pack and shipping box) (1p) item: part number (1t) lot: lot number lpn: (9d)mfg date: manufacturing date (p) customer item: (v) vendor id: deptid: made in: country of origin (q) qty: quantity cat: intensity bin bin: refer to below information (9d) date code: date code standard label ls0002 rohs compliant e3 max temp 260c
for product information and a complete list of distributors, please go to our web site: www . avagotech . com avago, avago technologies, and the a logo are trademarks of avago technologies in the united states and other countries. data subject to change. copyright ? 2005-2009 avago technologies. all rights reserved. av02-1568en - november 4, 2009 disclaimer: avagos products and software are not specifically designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, main- tenance or direct operation of a nuclear facility or for use in medical devices or applications. customer is solely responsible, and waives all rights to make claims against avago or its sup- pliers, for all loss, damage, expense or liability in connection with such use. acronyms and de?nition: bin: (i) color bin only or vf bin only (applicable for part number with color bins but without vf bin or part number with vf bins and no color bin) or (ii) color bin incorporated with vf bin (applicable for part number that have both color bin and vf bin) (ii) avago baby label (only available on bulk packaging) example: (i) color bin only or vf bin only bin: 2 (represent color bin 2 only) bin: vb (represent vf bin vb only) (ii) color bin incorporate with vf bin bin: 2vb vb: vf bin vb 2: color bin 2 only (1p) part #: part number (1t) lot #: lot number (9d)mfg date: manufacturing date c/o: country of origin customer p/n: supplier code: quantity: packing quantity cat: intensity bin bin: refer to below information datecode: date code rohs compliant e3 max tem p 260c lam p s bab y label

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